Infineon
Intelligent Power Modules (IPM)
Infineon
IRSM005-301MHTR
CIPOS™ Nano 100 V, 0.02 Ω half-bridge MOSFET based intelligent power module providing ultra compact, half-bridge topology solution through a rugged IC in a small QFN package for small home appliances, low power drives which are space-constrained.
Request Model
Infineon
IRSM005-800MH
CIPOS™ Nano 40 V, 0.005 Ω half-bridge MOSFET based intelligent power module in QFN 7x8 package providing ultra compact, half-bridge topology solution through a rugged IC in the small QFN package for small home appliances, low power drives which are space-constrained.
Request Model
Infineon
IRSM005-800MHTR
CIPOS™ Nano 40 V, 0.005 Ω half-bridge MOSFET based intelligent power module in QFN 7x8 package providing ultra compact, half-bridge topology solution through a rugged IC in the small QFN package for small home appliances, low power drives which are space-constrained.
Request Model
Infineon
IRSM807-045MH
CIPOS™ Nano 500 V, 1.7 Ω half-bridge MOSFET based intelligent power module in QFN 8x9 package providing ultra compact, half-bridge topology solution through a rugged IC in the small QFN package for small home appliances, low power drives which are space-constrained.
Request Model
Infineon
IRSM807-045MHTR
CIPOS™ Nano 500 V, 1.7 Ω half-bridge MOSFET based intelligent power module in QFN 8x9 package providing ultra compact, half-bridge topology solution through a rugged IC in the small QFN package for small home appliances, low power drives which are space-constrained.
Request Model
Infineon
IRSM807-105MH
CIPOS™ Nano 500 V, 0.8 Ω half-bridge MOSFET based intelligent power module in QFN 8x9 package providing ultra compact, half-bridge topology solution through a rugged IC in the small QFN package for small home appliances, low power drives which are space-constrained.
Request Model
Infineon
IRSM807-105MHTR
CIPOS™ Nano 500 V, 0.8 Ω half-bridge MOSFET based intelligent power module in QFN 8x9 package providing ultra compact, half-bridge topology solution through a rugged IC in the small QFN package for small home appliances, low power drives which are space-constrained.
Request Model
Infineon
IRSM808-105MH
CIPOS™ Nano 500 V, 0.8 Ω half-bridge MOSFET based intelligent power module in QFN 8x9 package providing ultra compact, half-bridge topology solution through a rugged IC in the small QFN package for small home appliances, low power drives which are space-constrained. Also, its inverted logic for low side switch (LIN) and adjustable deadtime enable users to run this half bridge IPM using single PWM signal.
Request Model
Infineon
IRSM808-105MHTR
CIPOS™ Nano 500 V, 0.8 Ω half-bridge MOSFET based intelligent power module in QFN 8x9 package providing ultra compact, half-bridge topology solution through a rugged IC in the small QFN package for small home appliances, low power drives which are space-constrained. Also, its inverted logic for low side switch (LIN) and adjustable deadtime enable users to run this half bridge IPM using single PWM signal.
Request Model
Infineon
IRSM808-204MHTR
CIPOS™ Nano 250 V, 0.15 Ω half-bridge MOSFET based intelligent power module in QFN 8x9 package providing ultra compact, half-bridge topology solution through a rugged IC in a small QFN package for small home appliances, low power drives which are space-constrained. Also, its inverted logic for low side switch (LIN) and adjustable deadtime enable users to run this half bridge IPM using single PWM signal.
Request Model