EasyPACK™ 2B 1200 V, 11 mΩ fourpack module with CoolSiC™ MOSFET, NTC, and PressFIT Contact Technology.This module offers improved and optimal pin orientation to enable easy and fast designs.New generation M1H product F4-8MR12W2M1H_B76 coming soon.

EasyPACK™ 2B CoolSiC™ MOSFET fourpack module 1200 V, 11 mΩ G1 with NTC, pre-applied thermal interface material (TIM) and PressFIT contact technology.

EasyPACK™ 1B, 8 mΩ halfbridge module implementing the new CoolSiC™ Automotive MOSFET 1200V, NTC temperature sensor and PressFIT contact technology. With the full automotive qualification, the field of applications for CoolSIC™ is now extended to high voltage automotive applications with high efficiency and switching frequency requirements, such as HV/HV DC-DC step-up converters, multiphase inverters and fast-switching auxiliary drives like fuel-cell compressors.

XHP™ 2 CoolSiC™ MOSFET halfbridge module 3.3 kV, 4.0 mΩ with .XT interconnection technology for decarbonizing transportation.

The power module implements the new CoolSiC™ Automotive MOSFET 1200V, optimized for electric drive train applications.

The power module implements the new CoolSiC™ Automotive MOSFET 1200V, optimized for electric drive train applications.

The power module implements the new CoolSiC™ Automotive MOSFET 1200V, optimized for electric drive train applications.