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Infineon F411MR12W2M1HPB76BPSA1

EasyPACK™ 2B CoolSiC™ MOSFET fourpack module 1200 V, 11 mΩ G1 with NTC, pre-applied thermal interface material (TIM) and PressFIT contact technology.
Built by Infineon

The CAD models below were provided for download to Ultra Librarian by Infineon. All CAD formats may not be available.

Symbol

Symbol preview for F411MR12W2M1HPB76BPSA1

Footprint

Footprint preview for F411MR12W2M1HPB76BPSA1

3D Model

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