CIPOS™ Micro 600 V, 4 A three-phase RCD2 IGBT based intelligent power module with open emitter in SOP 29x12 package providing fully-featured compact inverter solution for low motor drive applications like fans, pumps and light load appliances.

CIPOS™ Micro 600 V, 4 A three-phase RCD2 IGBT based intelligent power module with open emitter in SOP 29x12 package providing fully-featured compact inverter solution for low motor drive applications like fans, pumps and light load appliances.

CIPOS™ Micro 600 V, 6 A three-phase RCD2 IGBT based intelligent power module with open emitter in DIP 29x12 package providing fully-featured compact inverter solution for low motor drive applications like fans, pumps and light load appliances.

CIPOS™ Micro 600 V, 6 A three-phase RCD2 IGBT based intelligent power module with open emitter in SOP 29x12 package providing fully-featured compact inverter solution for low motor drive applications like fans, pumps and light load appliances.

CIPOS™ Tiny 600 V, 15 A three-phase IGBT based Intelligent Power Module in DIP 33x19 package with normal lead length (7.2mm).The Tiny IM323 product group offers the chance for integrating various power and control components to increase reliability, optimize PCB size and system costs. It is designed to control three phase AC motors and permanent magnet motors in variable speed drives for application like an air conditioning and washing machine. The package concept is specially adapted to power application, which need good thermal conduction and electrical isolation, also EMI-save control and overload protection. The reverse conducting IGBTs are combined with an optimized SOI gate driver for excellent electrical performance.

CIPOS™ Tiny 600 V, 15 A three-phase IGBT based Intelligent Power Module in DIP 33x19 package with short lead length(5.7mm).The Tiny IM323 product group offers the chance for integrating various power and control components to increase reliability, optimize PCB size and system costs. It is designed to control three phase AC motors and permanent magnet motors in variable speed drives for application like an air conditioning and washing machine. The package concept is specially adapted to power application, which need good thermal conduction and electrical isolation, also EMI-save control and overload protection. The reverse conducting IGBTs are combined with an optimized SOI gate driver for excellent electrical performance.

CIPOS™ Maxi 1200 V, 15 A three-phase IGBT based intelligent power module with open emitter in DIP 36x23D package providing fully-featured compact inverter solution with excellent thermal conduction for motor drive applications including industrial drives, fans and pumps, HVAC outdoor fan, active filters, and etc.

CIPOS™ Maxi 1200 V, 20 A three-phase CoolSiC™ MOSFET based intelligent power module with open emitter in DIP 36x23D package providing fully-featured compact inverter solution with excellent thermal conduction for industrial applications including industrial drives, HVAC, active filters, motor controls and etc.

CIPOS™ Mini 600 V, 30 A three-phase TRENCHSTOP™ IGBT based intelligent power module with open emitter in DIP 36x21D package. It provides fully featured compact inverter solution with DCB substrate to enable excellent thermal performance. Moreover, it enables higher power capability based on Infineon’s leading-edge TRENCHSTOP™ IGBTs and anti-parallel diodes together with optimized SOI gate driver along with excellent thermal conduction and electrical isolation.Coming soon: EVAL-M1-IM535

CIPOS™ Nano 250 V, 0.15 Ω half-bridge MOSFET based intelligent power module in QFN 8x9 package providing ultra compact, half-bridge topology solution through a rugged IC in a small QFN package for small home appliances, low power drives which are space-constrained. Also, its inverted logic for low side switch (LIN) and adjustable deadtime enable users to run this half bridge IPM using single PWM signal.