HybridPACKTM 1 700 V, 400 A 3-phase six-pack TRENCHSTOPTM IGBT3 with emitter controlled diode is an automotive qualified power module designed for electric vehicle applications.The HybridPACKTM 1 power module is built on Infineon’s long time experience in the development of IGBT power modules, intense research efforts of new material combinations and assembly technologies. HybridPACKTM 1 is suitable for air or liquid cooling. The copper base plate combined with high-performance ceramic substrate and Infineon’s enhanced wire-bonding process provides unparalleled thermal and power cycling capability and highest reliability for mild hybrid inverter or generator applications. For a compact design the driver stage PCB can easily be soldered on top of the module. All power connections are realized with screw terminals.

The HybridPACKTM power module is built on Infineon’s long time experience in the development of IGBT power modules, intense research efforts of new material combinations and assembly technologies. HybridPACKTM is suitable for air or liquid cooling. The copper base plate combined with high-performance ceramic substrate and Infineon’s enhanced wire-bonding process provides unparalleled thermal and power cycling capability and highest reliability for mild hybrid inverter or generator applications. For a compact design the driver stage PCB can easily be soldered on top of the module. All power connections are realized with screw terminals.

HybridPACK™ DC6 Wave 705V, 400 A six-pack TRENCHSTOPTM IGBT3 with emitter controlled diode and NTC is a very compact power module optimized for hybrid and electric vehicle main inverter applications (xEV) based on established solder and screw interconnections.

EasyPACK™ 1B Modules with Trench/Fieldstop IGBT3, Emitter Controlled 3 diode and PressFIT / NTC.Evaluation Board available

The power module implements Infineon’s next generation IGBT chip technology 1200V, optimized for electric drive train applications, from mid- to high-range automotive power classes.

This power module complements the benchmark EDT2 IGBT generation with Direct Cooled Base Plate with Ribbon Bonds, NTC temperature sensor and PressFIT contact technology for up to 500V DC and 400 Arms capability enabling inverter designs around 100kW power range*.

EasyPACK™ 2B Modules with TRENCHSTOP™ IGBT3, Emitter Controlled 3 diode and PressFIT / NTC.

The HybridPACK™ Drive module with EDT2 IGBT and Diode is an automotive qualified power module designed for Hybrid- and Electric Vehicle applications. The direct cooled baseplate with PinFin structure in the FS820R08A6P2 product best utilizes the implemented chipset and shows superior thermal characteristics.

HybridPACK™ 2 750 V, 900 A 3-phase six-pack of Micro-Pattern EDT2 TRENCHSTOPTM with matching emitter controlled diode is an automotive qualified power module with direct cooled PinFin Base Plate designed for Hybrid- and Electric Vehicle applications from a power range up to 150 kW continuous power. Pin connection is enabled via Sn coated pins.

HybridPACK™ 2 750 V, 900 A 3-phase six-pack of Micro-Pattern EDT2 TRENCHSTOPTM with matching emitter controlled diode is an automotive qualified power module with direct cooled PinFin Base Plate designed for Hybrid- and Electric Vehicle applications from a power range up to 150 kW continuous power. Pin connection is enabled via Au coated pins.