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TE Connectivity


LGA Sockets

Our land grid array (LGA) sockets provide compressive electrical interconnect between the processor and the printed circuit boards (PCBs). As computing power increases, so does the chips' pin counts. A robust bolster plate provides a reliable interconnection to the microprocessor package and limits PCB bowing during compression to ensure a reliable connection. The contact tip geometry is optimized to reduce risk of contact damage during handling and package installation. Our LGA sockets feature flexible tooling that provide high-quality, fast turnaround time for prototypes so sockets can be in your hands at the earliest stages of your program.

TE Connectivity
2-2129710-8
RIGHT SIDE LGA3647-1 SOCKET-P1 FOR ODM
Models Available
TE Connectivity
2-2347090-1
SOCKET 4677 DG1.0 FOR ODM
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TE Connectivity
2-2822979-3
LGA3647-0 SOCKET P0 KIT FOR ODM (30U AU)
Models Available
TE Connectivity
2-2822979-4
LGA3647-1 SOCKET-P1 KIT FOR ODM (30U AU)
Models Available
TE Connectivity
2134928-1
SOCKET ASSY LGA1150
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TE Connectivity
2174988-1
SOCKET ASSY LGA2011-1, 0.38Au
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TE Connectivity
2174988-2
SOCKET ASSY LGA2011-1 0.76um Au
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TE Connectivity
2201838-1
SOCKET ASSY LGA2011-3
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TE Connectivity
2201838-2
SOCKET ASSY LGA2011-3 0.76um Au
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TE Connectivity
2287402-1
SOCKET ASSY LGA1151, 0.38AU
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