1. Infineon
  2. RF & Wireless Control
  3. Low Noise Amplifier (LNA)
  4. GPS / GLONASS / COMPASS LNA

Infineon BGA713N7E6327XTSA1

The BGA713L7 is a low current single-band low noise amplifier MMIC for UMTS bands XII, XIII, XIV, XVII and XX. The LNA is based upon Infineon’s proprietary and cost-effective SiGe:C technology and comes in a low profile TSNP-7-1 or TSNP-7-2 leadless green packages. This document specifies electrical parameters, pinout, application circuit and packaging of the chip.

Symbol

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Footprint

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3D Model

No 3D Model Available

Symbol Views

(not all views will be available for every part)

Normal: Standard and most popular representation of schematic symbol

ALT_1 (IEEE view): Symbol representation in a way that is more graphical in explaining what the purpose of each pin is. For connectors and most discretes (as we use these views) it is simply an alternate view for people to use depending on the situation. For instance connectors can be generally an input, an output or neither. Resistors can be vertical or horizontal.

ALT_2 (demorgan): Demorgan is a name for an equivalent Gate structure. so for instance an AND gate and an OR gate can be represented by its Demorgan equivalent of a NOR gate.

Sometimes a device is fractured into multiple symbols (often for high pin count parts). If that is the case, you can preview the different symbols that make up the device by selecting them in this drop down.

Footprint Views

(not all views will be available for every part)

Basic: Our standard footprint view showing, contact area, pin number, top, top assembly

Detailed: Additional info to help you evaluate the part and the footprint including: dimension, silkscreen, soldermask, and solderpaste

PinDetail: Highlights the pin to pad contact area dimensions

Displays min/typ/max pad sizes for footprint per IPC specification (not all sizes will be available for every part)

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