1. Infineon
  2. Power
  3. Diodes & Thyristors
  4. CoolSiC™ Schottky Diodes

Infineon IDDD12G65C6XTMA1

Infineon Technologies introduces Double DPAK (DDPAK), the first top-side cooled surface-mount-device (SMD) package addressing high power SMPS applications such as PC power, solar, server and telecom. The benefits of the already existing high voltage technology CoolSiC™ Schottky diode 650V G6 is combined with the innovative concept of top-side cooling, providing a system solution for high current hard switching topologies such as PFC and a high-end efficiency solution for LLC topologies.
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