1. Infineon
  2. Interface
  3. Automotive Transceiver
  4. Automotive FlexRay™ Transceivers

Infineon TLE9221SXXUMA2

FlexRay is a serial, deterministic bus system for real-time control applications. It is designed for future requirements of in-vehicle control applications, providing data transmission rates up to 10 Mbit/s. FlexRay is designed for collision-free data communication. The nodes do not arbitrate and the FlexRay Communication Controller (CC) guarantees a collision-free bus access during normal operation. The FlexRay bus system is patent-protected by the international FlexRay consortium. The consortium defines and publishes the requirements for FlexRay bus systems, for the data-link layer, the physical layer and all other requisite application layers. The TLE9221SX FlexRay transceiver is a FlexRay bus driver (BD) and it accomplishes the physical interface between the Communication Controller and the bus medium. Fully compliant with the FlexRay Electrical Physical Layer Specification, version 3.0.1 (acronym EPL).

Symbol

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Footprint

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3D Model

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Symbol Views

(not all views will be available for every part)

Normal: Standard and most popular representation of schematic symbol

ALT_1 (IEEE view): Symbol representation in a way that is more graphical in explaining what the purpose of each pin is. For connectors and most discretes (as we use these views) it is simply an alternate view for people to use depending on the situation. For instance connectors can be generally an input, an output or neither. Resistors can be vertical or horizontal.

ALT_2 (demorgan): Demorgan is a name for an equivalent Gate structure. so for instance an AND gate and an OR gate can be represented by its Demorgan equivalent of a NOR gate.

Sometimes a device is fractured into multiple symbols (often for high pin count parts). If that is the case, you can preview the different symbols that make up the device by selecting them in this drop down.

Footprint Views

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Basic: Our standard footprint view showing, contact area, pin number, top, top assembly

Detailed: Additional info to help you evaluate the part and the footprint including: dimension, silkscreen, soldermask, and solderpaste

PinDetail: Highlights the pin to pad contact area dimensions

Displays min/typ/max pad sizes for footprint per IPC specification (not all sizes will be available for every part)

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