1. Infineon
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  3. MEMS Microphones
  4. MEMS Microphones for consumer

Infineon IM70A135V01XTMA1

Infineon’s XENSIV™ MEMS analog microphone IM70A135 is a compact high-performance microphone with a very high acoustic overload point of 135 dBSPL and a size of only 3.50 x 2.65 x 1.00 mm3. This microphone is based on Infineon’s new Sealed Dual Membrane MEMS technology which delivers high ingress protection (IP57) at a microphone level. The small size makes this microphone especially suited for TWS earbud applications.
Built by Infineon

The CAD models below were provided for download to Ultra Librarian by Infineon. All CAD formats may not be available.

Symbol

Symbol preview for IM70A135V01XTMA1

Footprint

Footprint preview for IM70A135V01XTMA1

3D Model

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