1. Infineon
  2. Home AC-DC Power Conversion
  3. AC-DC Integrated Power Stage - CoolSET™
  4. Quasi Resonant CoolSET™

Infineon ICE2QR2280G1XUMA1

Integrated power management IC with 800V avalanche rugged CoolMOS™, startup cell and QR current mode flyback PWM controller in DSO-16/12 package. Capable for 25.5W SMPS design. This derivative has a lower UVLO voltage (9.85V) so that it can easier be used to optimize system design. The quasi QR CoolSET™ series continues to deliver design agility and miniaturization. Upon the successful F3 CoolSET™, this new series offer the possibility of higher efficiency and better EMI performance. The digital frequency reduction feature score a very stable operation with decreasing load change, and the fold-back correction keep the maximum power limits within tolerance desired by SMPS designers. The active burst mode operation during low power consumption, remains market leaders in providing best-in-class power consumption during standby.

Symbol

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Footprint

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3D Model

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Symbol Views

(not all views will be available for every part)

Normal: Standard and most popular representation of schematic symbol

ALT_1 (IEEE view): Symbol representation in a way that is more graphical in explaining what the purpose of each pin is. For connectors and most discretes (as we use these views) it is simply an alternate view for people to use depending on the situation. For instance connectors can be generally an input, an output or neither. Resistors can be vertical or horizontal.

ALT_2 (demorgan): Demorgan is a name for an equivalent Gate structure. so for instance an AND gate and an OR gate can be represented by its Demorgan equivalent of a NOR gate.

Sometimes a device is fractured into multiple symbols (often for high pin count parts). If that is the case, you can preview the different symbols that make up the device by selecting them in this drop down.

Footprint Views

(not all views will be available for every part)

Basic: Our standard footprint view showing, contact area, pin number, top, top assembly

Detailed: Additional info to help you evaluate the part and the footprint including: dimension, silkscreen, soldermask, and solderpaste

PinDetail: Highlights the pin to pad contact area dimensions

Displays min/typ/max pad sizes for footprint per IPC specification (not all sizes will be available for every part)

Additional Info
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Tech Specs
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