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Infineon BTM7700GXUMA1

The BTM7700G is part of the Trilith IC family containing three dies in one package: One double high- side switch and two low- side switches. The drains of these three vertical DMOS chips are mounted on separated lead frames. The sources are connected to individual pins, so the BTM7700G can be used in H- bridge- as well as in any other configuration. The double high- side switch is manufactured in SMART SIPMOS ® technology which combines low R DS ON vertical DMOS power stages with CMOS circuitry for control, protection and diagnosis. To achieve low R DS ON and fast switching performance, the low- side switches are manufactured in S- FET logic level technology.

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Symbol Views

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Normal: Standard and most popular representation of schematic symbol

ALT_1 (IEEE view): Symbol representation in a way that is more graphical in explaining what the purpose of each pin is. For connectors and most discretes (as we use these views) it is simply an alternate view for people to use depending on the situation. For instance connectors can be generally an input, an output or neither. Resistors can be vertical or horizontal.

ALT_2 (demorgan): Demorgan is a name for an equivalent Gate structure. so for instance an AND gate and an OR gate can be represented by its Demorgan equivalent of a NOR gate.

Sometimes a device is fractured into multiple symbols (often for high pin count parts). If that is the case, you can preview the different symbols that make up the device by selecting them in this drop down.

Footprint Views

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Basic: Our standard footprint view showing, contact area, pin number, top, top assembly

Detailed: Additional info to help you evaluate the part and the footprint including: dimension, silkscreen, soldermask, and solderpaste

PinDetail: Highlights the pin to pad contact area dimensions

Displays min/typ/max pad sizes for footprint per IPC specification (not all sizes will be available for every part)

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